<div style="margin: 0px 22px 20px; padding: 0px; box-sizing: border-box; border: none; font-family: Roboto, Arial, sans-serif; font-size: 14px;"><figure style="margin: 0px; padding: 0px; box-sizing: border-box; border: none;"><div style="margin: 0px; padding: 0px 0px 551.25px; box-sizing: border-box; display: flex; width: 980px; position: relative; background-color: #c4c4c4;"><img src="http://s.rfi.fr/media/display/85f43a2a-0d5f-11ea-aec7-005056bfe576/w:900/p:16×9/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg" alt="半导体报道图片" data-image-dataset="[{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:170\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":170,"height":96,"name":"170×96"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:200\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":200,"height":113,"name":"200×113"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:240\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":240,"height":135,"name":"240×135"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:280\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":280,"height":158,"name":"280×158"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:310\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":310,"height":174,"name":"310×174"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:400\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":400,"height":225,"name":"400×225"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:480\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":480,"height":270,"name":"480×270"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:650\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":650,"height":366,"name":"650×366"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:900\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":900,"height":506,"name":"900×506"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:980\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":980,"height":551,"name":"980×551"},{"url":"http:\\/\\/s.rfi.fr\\/media\\/display\\/85f43a2a-0d5f-11ea-aec7-005056bfe576\\/w:1240\\/p:16×9\\/https_2f2fs3-ap-northeast-1.amazonaws.com2fpsh-ex-ftnikkei-3937bb42fimages2f92f82f12f22f13382189-1-eng-gb2f20180315-china-semiconductor-reuters.jpg","width":1240,"height":698,"name":"1240×698"}]" style="position: absolute; width: 980px; height: 551.25px; transition: opacity 0.3s ease 0s; font-size: 14pt;" /></div><figcaption style="font-size: 1.5rem; color: #9a9a9a; padding: 8px 0px;"><em><span style="font-size: 14pt;">半导体报道图片 </span><span style="margin: 0px 2px; font-size: 14pt;">路透社图片</span></em></figcaption></figure></div><p style="margin-right: auto; margin-bottom: 28px; margin-left: auto; padding: 0px; box-sizing: border-box; border: none; font-size: 1.9rem; font-weight: 700; line-height: 1.5; max-width: 850px; font-family: Roboto, Arial, sans-serif;"><span style="font-size: 14pt;">为加强防备转为军事用途及网络攻击，加入出口管制国际框架的日本、美国等42个国家已扩大管制对象。对象中新追加了可转为军用的半导体基板制造技术及被用于网络攻击的军用软件等。共同社指，据分析此举旨在防止技术外流到中国及朝鲜等。日本政府计划今后加强产品及相关技术的出口手续，新管制对象也包括日本厂商擅长的领域，部分企业或受到影响。</span></p><div style="margin: 0px auto 20px; padding: 0px; box-sizing: border-box; border: none; max-width: 850px; font-family: Roboto, Arial, sans-serif; font-size: 14px;"><div style="margin: 0px; padding: 0px; box-sizing: border-box; position: relative; display: flex; -moz-box-pack: center; justify-content: center; float: right;"><div style="margin: 0px; padding: 0px 0px 0px 30px; box-sizing: content-box; border: none; -webkit-box-pack: center; justify-content: center; flex-wrap: wrap; display: flex; width: 300px;"></div></div><p style="margin-bottom: 28px; padding: 0px; box-sizing: border-box; border: none; font-size: 1.7rem; line-height: 1.4;"><span style="font-size: 14pt;">据共同社报道说，23日获悉42个国家加强半导体基板技术出口管制。</span></p><p style="margin-bottom: 28px; padding: 0px; box-sizing: border-box; border: none; font-size: 1.7rem; line-height: 1.4;"><span style="font-size: 14pt;">美国和伊朗的对立导致对基础设施及军事系统受到网络攻击的担忧高涨。日本也曝出针对三菱电机及NEC的攻击。在采取全球性对策必要性升温的情况下，除网络攻击软件外，对监视通信的技术及系统、复原数据的电子识别系统等“肉眼看不见的武器”进行管理也被认为有必要。</span></p><p style="margin-bottom: 28px; padding: 0px; box-sizing: border-box; border: none; font-size: 1.7rem; line-height: 1.4;"><span style="font-size: 14pt;">该报道称，该框架称为《瓦森纳协定》，出于防止国际恐怖等安全保障的观点管制武器及可转为军用的物品与技术的出口，以往以常规武器及部分机床等为主。成员国除日美外，还有英国、俄罗斯、印度、韩国等。中国、伊朗及朝鲜未参加。</span></p><p style="margin-bottom: 28px; padding: 0px; box-sizing: border-box; border: none; font-size: 1.7rem; line-height: 1.4;"><span style="font-size: 14pt;">据该协定规定，进行管制必需全体成员国同意，去年12月在奥地利召开的出口管理部门会议上，各国代表一致同意扩大管制对象。由此，为在日本完善所需的法律，经济产业省等将敲定细节。据分析将纳入出口至任何国家都需获得许可的“管制清单”对象品种。</span></p><div id="tms-ad-inread-518427656948834" data-tms-ad-type="inread" data-tms-ad-provider="teads" data-tms-ad-status="idle" style="margin: 0px auto; padding: 0px; box-sizing: border-box; border: none; max-width: 530px; line-height: 0; font-size: 0px; overflow: hidden;"><div style="margin: 0px; padding: 0px; box-sizing: border-box; border: none;"></div></div><p style="margin-bottom: 28px; padding: 0px; box-sizing: border-box; border: none; font-size: 1.7rem; line-height: 1.4;"><span style="font-size: 14pt;">报道称，国内有从事高性能半导体基板材料硅晶圆制造的厂商。高性能晶圆是使用纳米级细光设计的最尖端半导体芯片制造中不可或缺的零部件。若成为管制对象，则产品及相关技术出口必需申请许可，厂商或不得不进行应对。</span></p></div>